Lead the development of next-generation silicon direct cooling technologies vis-à-vis Micro Channel Lid or Direct Silicon cooling to enable higher-performance computing platforms, collaborating closely with cross-functional engineering teams and external ecosystem partners including semiconductor packaging providers, silicon/ASIC vendors, and system integrators (ODMs).
Drive thermal management innovation across platforms ranging from general-purpose servers to advanced GPU systems, while demonstrating technical leadership in packaging technologies to address increasingly complex cooling challenges driven by rising compute density and power requirements
Key Objectives & Success Measures
Develop strong partnerships with external compute systems that are pertinent to the program
Negotiate for win-win on terms and conditions with internal and external partners
Define short and long-term milestones with all parties
Flawlessly execute the agreed upon milestones and track progress
Develop key IPs for CoolIT where possible to strengthen our foothold in this field
Key Responsibilities
Technical Development & Leadership
- Build out the internal and external support infrastructure for this new MCL and direct cooling technology
- Act as the key POC for external packaging companies, silicon vendors, and system integrator including OEMs and/or ODMs
- Lead by influence by clearly articulating the vision of this technology
Technical Customer Engagement
- Act as the primary technical interface for this micro-channel lid or direct cooling technology to engage customers while partnering closely with internal teams
- Sensitize and translate partners’ and customers’ requests and pain points into actionable items to drive solution
- Support design reviews, technical enablement, failure analysis, and customer engagement
- Understanding of customers’ and silicon roadmap to determine how CoolIT’s technical capability can provide value
Partner Management
- Build strong relationships across internal functional organizations: Advanced Technology Group, Coldplate engineering, and/or CDU engineering.
- Partner with our manufacturing operations to ensure CoolIT’s products are built with DFx (DFM, DFS, DFT, etc) in mind
Preferred
- Master of Science degree in related discipline with background in electronic packaging, chip package designs and/or chip cooling solution.
- Prior experience in electronic packaging industry and/or chip design industry
- Established relationships within OSATs, ODMs and/or chip vendors
Skills & Attributes
- Highly analytical and strategic thinker with quality and reliability of product in mind
- Skilled in DFx (x = manufacturability, reliability, and/or test)
- Comfortable in operating with ambiguity in fast‑evolving technology markets
- Excellent communication skills in English; Mandarin proficiency strongly preferred