Responsible to lead Si photonics packaging technology development. Work with cross functional team and lead optical engine module, optical coupling design/fiber array connector and co-packaging optics development efforts. Si photonics based optical engine package architecture / Package integration and drive micro-optical component assembly/interface characterization through Innovation Work with optical component vendors, foundry and OSAT to bring Si photonics packaging solution from concept to HVM. Minimum 5% International travel.
Minimum Qualifications
BS and 10+ years of experience in relevant industry experience
Preferred Qualifications
M.S or Ph.D. in Physic (Optics major), Electrical Engineering, Materials Science, Mechanical Engineering or an equivalent field desired, preferred.
Excellent teamwork and communication skills.
Strong theoretical background in optics and photonics fundamentals, device/module integration.
Hands-on experience in packaging and measuring fiber-coupled devices.
Hands-on experience in optical component design, simulation and qualification, and single / multi-mode fiber assembly using active and passive alignment tool.
Min. 5 years works experiences in the related field with M.S and or Ph.D.
Hands-on experience of CMOS BEOL wafer scale processing and flip chip assembly (CoC, CoW, WLP, …)
Experience with silicon photonics device laser, modulator, PD, passive components, such as, Si WG, MUX/DeMUX is a plus.