Provide comprehensive Failure Analysis during development NPI process. Perform hands-on FA work using advanced FA tools and methodologies to uncover failure mechanisms. Work with various functional teams for root cause identification, simulation and solutions.

Minimum Qualifications
Degree/Master holder in Materials/Chemistry/Electrical Engineering

Possess a strong command of failure analysis methods and in any of the corresponding field experience: 3+ years’ experience in electrical fault isolation OR 3+ years’ experience in physical FA using X-ray/SEM/FIB/X-sect OR Experience in surface morphology tools

Preferred Qualifications
Knowledge of IC assembly packaging design, process and testing
Passionate in photography, keen in camera technology
Ability to work independently, yet also be a strong team-player who thrives in dynamic and ever-changing work environments.
Strong solution-focused work ethic with a high degree of flexibility supporting multiple projects of varying complexity and priority.
Self-motivated with strong written and verbal communications skills
Auger experience is a plus
Nano-indenter experience is a plus
Process FA experience in semiconductors or optical devices is a plus