This position blends finite element simulation with hands-on materials characterization. You will work on semiconductor packages, PCB systems, and SMT assemblies — developing predictive models that inform design direction, reliability strategy, and manufacturing readiness. You’ll partner closely with design, reliability, and manufacturing teams to define key load cases, build and validate material models, and reduce risk early in development. Your work will help close the gap between simulation and hardware through disciplined experimentation and correlation.

Minimum Qualifications
7+ years of experience in finite element modeling
Strong foundation in solid mechanics and thermomechanics
Experience with CAE tools such as Ansys, Abaqus, or equivalent
Experience working with materials used in microelectronics applications
MS or PhD in Mechanical Engineering, Materials Science, Applied Mechanics, Chemical Engineering, or related field

Preferred Qualifications
Experience in warpage, fracture mechanics, fatigue, or drop/impact modeling
Familiarity with semiconductor packaging and SMT processes
Experience correlating simulation models with physical testing
Understanding of DOE methodology and reliability physics
Strong written and verbal communication skills
Comfortable working in a fast-paced, cross-functional environment