We are looking for a senior level advanced packaging engineer to develop exciting new products. Your role is to interface between internal product/device design, process integration and external suppliers to develop and deploy new packaging technologies. We are looking for individuals who are very innovative with a proven track record to bring packaging solution from concept to high-volume manufacturing.
Minimum Qualifications
M.S or Ph.D. degree in Photonics, Physics, Materials science or similar disciplines with a minimum of 5 years of experience in high performance computing, data center and SiPH (silicon photonics) applications.
In-depth knowledge in advanced 2.5D/3D packaging for EIC/PIC die integration, Chip-on-Wafer processes, Photonic component assembly (FAU and fiber) and MCM module assembly.
Preferred Qualifications
Good understanding to optics and photonics fundamentals, device/module integration.
Knowledge in Optical device laser, modulator, photo detector, passive components is a plus.
Proven track record to drive issue resolution with good understanding to root cause and physics, motivate and mobilize all levels within supplier to accomplish any given task. Able to perform independent research and development work with minimal supervision.
Good written and verbal communication skills. Able to present ideas, design concepts, data and plan with high confidence at internal or external meetings.