Responsibilities - Die Attach, Wire Bonding, Sealing, Laser Marking, RF-Testing, Packaging and Tape & Reel - Loading /Unloading Equipment - Operate/Run Production Equipment - Microscope inspection - Lifting = 10lbs - Enter Data in Database system - Die Attach: Experience in Die Attach / Datacon Equipment preferred - Bonding: Experience in Wire Bonding / H&K Equipment preferred - RF Testing: Experience in Testing of IC’s / Automatic and/or Manual Testing - All other operations: Experience Production Assembly preferred QUALIFICATIONS - 1 year experience in Assembly preferred (not required) - Experience and ability to work in a fast-paced manufacturing environment. - Must be able to work well with all levels of personnel whether individually or in a team environment. - Open to work overtime including possible weekends - Computer experience/operation necessary. - The operator will work on a class 10k cleanroom environment Education - Hight School Dimple (Required)